n the dark, starless night, the falcon strikes fear into the heart of its prey. Even with minimal visibility, the falcon pinpoints its prey and patiently anticipates the perfect moment to swoop in for the kill. The falcon with its laser sharp gaze dominates the darkness of night in the same manner that AORUS Core Lighting illuminates the vast AORUS ecosystem.
GIGABYTE X570 motherboards based on the AMD X570 Chipset provide full support for 3rd Gen AMD Ryzen™ Processors. The all-new design is a testament to GIGABYTE's dedication to design quality. GIGABYTE X570 motherboards offer a rich list of features such as support for PCIe 4.0 and USB Type-C™ interfaces on select boards, refined audio, high speed of Ethernet and latest standard of WIFI design, to fulfill users' performance, audio, and data transfer needs. The new, advanced power and thermal design enables users to unleash the performance on AMD Ryzen™ 3000-series Processors, making the GIGABYTE X570 motherboards perfect for users looking to build the best AMD platform gaming system.
Ultimate Power Design
To unleash the full potential of the 3rd Generation of AMD Ryzen™ CPU, the motherboard requires the best CPU power design. With the best quality components and GIGABYTE R&D design capability, the X570 AORUS is a true beast among motherboards.
12+2 Phases Digital Power
Power Architecture
2X Copper PCB

X570 AORUS ULTRA reaches a perfect balance between style and performance by combining the media acclaimed Fins-Array heatsink and Direct Touch heatpipe, to heatpipe provide 30% lower MOSFET temperatures for enthusiasts, overclockers and professional gamers.
Fins-Array Heatsink with Direct Touch Heatpipe and High Thermal Conductivity Pad
X570 AORUS ULTRA uses Fins-Array Heatsink which increases the heat dissipation area by 300% compared to traditional heatsinks of the same size. Direct Touch Heatpipe helps transfer heat from MOS fins. By using LAIRD 1.5mm thick, 5W/mK high thermal conductivity pads, it can transfer 2.7x more heat compared to traditional thermal pads in the same time period.
High Thermal Conductivity Pad
Direct Touch Heatpipe
Smart Fan
- Provides 3 different operating modes to minimize noise and extend the fan’s longevity. Silent, Balanced and Performance modes, choose the mode that suits you the best in any situation.
High Durability
* MTBF, A standard measurement that continuously operates under certain criteria with 90 % of confidence level.
- X570 motherboards adopt a high quality ball bearing fan which guarantees 60,000* working hours.
Full PCIe 4.0 Design
X570 AORUS pushes the envelope once again by featuring Full PCIe 4.0 Design, including PCIe 4.0 slots, PCIe 4.0 M.2 connectors, and delivering highly optimized performance and flexibility demanded for power users and extreme gaming enthusiasts.
PCIe 4.0 Hardware
PCIe 4.0 M.2 with Thermal Guard
XMP 4400+

Next Generation Connectivity
A high-end product needs to be future-proof so your system stays up-to-date with the latest technology. X570 AORUS motherboards provide all next generation network, storage, and WIFI connectivity to keep you up to speed.

The AORUS motherboards boast a combination of Hi-Fi grade WIMA FKP2 capacitors and high-end Chemicon audio capacitors. While the high-end audio capacitors are suited for high-grade audio equipment, using state of the art technology to provide rich sound in the bass and clearer high frequencies, the WIMA FKP2 capacitors are being used widely in premium grade Hi-Fi systems. The addition of this to the exclusive AOURS AMP-UP Audio technology makes for the ideal onboard sound solution for the most demanding audiophiles.