SPECIFICATIONS
| Essentials | ||
| Status | Launched | |
| Launch Date | Q2'13 | |
| Processor Number | i5-4670K | |
| # of Cores | 4 | |
| # of Threads | 4 | |
| Clock Speed | 3.4 GHz | |
| Max Turbo Frequency | 3.8 GHz | |
| # of QPI Links | 1 | |
| Instruction Set | 64-bit | |
| Instruction Set Extensions | SSE 4.1/4.2, AVX 2.0 | |
Embedded Options Available
 |
No | |
| Lithography | 22 nm | |
| Max TDP | 84 W | |
| Thermal Solution Specification | PCG 2013D | |
| Memory Specifications | ||
| Max Memory Size (dependent on memory type) | 32 GB | |
| Memory Types | DDR3-1333/1600 | |
| # of Memory Channels | 2 | |
| Max Memory Bandwidth | 25.6 GB/s | |
| ECC Memory Supported
|
No | |
| Graphics Specifications | ||
| Processor Graphics | Intel® HD Graphics 4600 | |
| Graphics Base Frequency | 350 MHz | |
| Graphics Max Dynamic Frequency | 1.2 GHz | |
| Intel® Quick Sync Video | Yes | |
| Intel® InTru™ 3D Technology | Yes | |
| Intel® Insider™ | Yes | |
| Intel® Wireless Display
|
Yes | |
| Intel® Clear Video HD Technology | Yes | |
| # of Displays Supported | 3 | |
| Expansion Options | ||
| PCI Express Revision | 3.0 | |
| PCI Express Configurations | Up to 1×16, 2×8, 1×8/2×4 | |
| # of PCI Express Lanes | 16 | |
| Package Specifications | ||
| Max CPU Configuration | 1 | |
| Package Size | 37.5mm x 37.5mm | |
| Graphics and IMC Lithography | 22nm | |
| Sockets Supported | FCLGA1150 | |
| Low Halogen Options Available | See MDDS | |
| Advanced Technologies | ||
| Intel® Turbo Boost Technology | 2.0 | |
| Intel® vPro Technology
|
No | |
| Intel® Virtualization Technology (VT-x)
|
Yes | |
| Intel® Virtualization Technology for Directed I/O (VT-d)
|
No | |
| AES New Instructions
|
Yes | |
| Intel® TSX-NI | No | |
| Intel® 64
|
Yes | |
| Intel® Anti-Theft Technology | Yes | |
| Idle States | Yes | |
| Enhanced Intel SpeedStep® Technology
|
Yes | |
| Thermal Monitoring Technologies | Yes | |
| Execute Disable Bit | Yes | |
| Intel® Secure Key | Yes | |
| Intel® Identity Protection Technology | Yes | |
