| Essentials | ||
| Status | Launched | |
| Launch Date | Q3'13 | |
| Processor Number | G3220 | |
| # of Cores | 2 | |
| # of Threads | 2 | |
| Clock Speed | 3 GHz | |
| Cache | 3 MB | |
| DMI2 | 5 GT/s | |
| # of QPI Links | 0 | |
| Instruction Set | 64-bit | |
| Instruction Set Extensions | SSE4.1/4.2 | |
Embedded Options Available
 |
No | |
| Lithography | 22 nm | |
| Max TDP | 54 W | |
| Thermal Solution Specification | PCG 2013C | |
| Recommended Customer Price | BOX : $64.00 TRAY: $64.00 |
|
| Memory Specifications | ||
| Max Memory Size (dependent on memory type) | 32 GB | |
| Memory Types | DDR3-1333 | |
| # of Memory Channels | 2 | |
| Max Memory Bandwidth | 25.6 GB/s | |
| ECC Memory Supported ‡
|
Yes | |
| Graphics Specifications | ||
| Processor Graphics ‡ | Yes | |
| Graphics Base Frequency | 350 MHz | |
| Graphics Max Dynamic Frequency | 1.1 GHz | |
| Intel® Quick Sync Video | No | |
| # of Displays Supported ‡ | 3 | |
| Expansion Options | ||
| PCI Express Revision | 3.0 | |
| PCI Express Configurations ‡ | Up to 1×16, 2×8, 1×8/2×4 | |
| Max # of PCI Express Lanes | 16 | |
| Package Specifications | ||
| Max CPU Configuration | 1 | |
| TCASE | 72°C | |
| Package Size | 37.5mm x 37.5mm | |
| Graphics and IMC Lithography | 22nm | |
| Sockets Supported | FCLGA1150 | |
| Low Halogen Options Available | See MDDS | |
| Advanced Technologies | ||
| Intel® vPro Technology ‡
|
No | |
| Intel® Hyper-Threading Technology ‡
|
No | |
| Intel® Virtualization Technology (VT-x) ‡
|
Yes | |
| Intel® Virtualization Technology for Directed I/O (VT-d) ‡
|
No | |
| Intel® VT-x with Extended Page Tables (EPT) ‡
|
Yes | |
| Intel® Trusted Execution Technology ‡
|
No | |
| AES New Instructions
|
No | |
| Intel® TSX-NI | No | |
| Intel® 64 ‡
|
Yes | |
| Idle States | Yes | |
| Enhanced Intel SpeedStep® Technology
|
Yes | |
| Thermal Monitoring Technologies | Yes | |
| Execute Disable Bit ‡ | Yes | |
| Intel® Stable Image Platform Program (SIPP) | No | |
