GIGABYTE AORUS X470 Gaming Motherboards feature a design concept inspired by the wings of an eagle. The sleek design of the I/O armor resembles the shape of the wing while the claw marks and airflow design are inspired by the wing's impressive aerodynamic features. The all new functions of AORUS X470 Motherboards which include their Fins-Array Heatsink, Direct Touch Heatpipe, metal reinforced base plate as well as integrated I/O shield reflect the efficient yet cool nature of the eagle's wings' kinetic motion while flying.




Ultra Durable Memory Armor

• 10 Phases Vcore, 2 Phases SOC (Memory Controller) Digital Power
• 40A for each Vcore Phase, 50A for each SOC phase
• Server level reliability
• High current capacity
• Lower temperature
- AORUS X470 motherboards use graphics card style stacked fins design, called Fins-Array Heatsink (>100 fins in total), increase close to 300% of heat dissipation area compared to traditional heatsink.
- Direct Touch Heatpipe helps transfer heat from MOS to heatsink and fins.
- The VRM temperature is 40% cooler than that of the traditional heatsink design.


- With an integrated base plate, GIGABYTE Motherboards give users a strong foundation to build their Gaming PCs.
- With an integrated I/O shield, building an GIGABYTE Ultra Durable PC is even easier.
- Integrated Power/Reset/Clear CMOS button on the I/O shield enables users easier debugging and operation.




New VB series audio controller stream your voice to the world vibrantly with both front/rear microphone SNR up to 110/114dB(A).

During In-Game Voice Chat


